time: Apr 14-16, 2015
Booth No: 610 and 608
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
2014 PLENARY SESSION PRESENTATIONS
Keynote talks from Honorary Chair, Dr. Professor Song Junde of BUPT, Guy Sene, President of EMG, Agilent Technologies (Platinum Sponsor), Guang Yang, Senior Mobile Communications Analyst, Strategy Analytics, Bertrum Arbesser-Rastburg, Head ESA-ESTEC, Dr. Guangyi Liu, senior Researcher, China Mobile Research Institute, Deng Jie, General Manager, ZTE Microwave Products Group and Feng Keming, General Director Beijing Institute of Radio Metrology and Measurement.
2014 TECHNICAL PROGRAM
The peer-reviewed technical paper sessions offer three tracks addressing:
• Measurement & Modeling
• System Engineering
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. In addition, the morning technical program will have a fourth track on commercial resources featuring sponsored papers.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
Workshops in development include: TD-LTE • 802.11ac • Carrier Aggregation • NFC • High-Speed Data Converters • FPGAs for Wireless Communications • RFICs • Front-ends • SATCOM • Radar Systems • EMC/EMI