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  • Capacitors: Mounting Capacitors - Binary Chip Capacitors

  • 供应商:

    Metelics
  • 描述:

    The Aeroflex / Metelics BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required.

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The Aeroflex / Metelics BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are add tive, so many combinations are possible.

 

The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding.

 

  • - High Reliability Silicon, Nitride-Oxide Dielectric
  • - Low Loss
  • - Long Term Reliability and Stability

 

 

  

.015 x .015

911R5K-BSP-3

913R0K-BSP-3

913R7K-BSP-3

915R6K-BSP-3

PAD 1

0.1 pF

0.2 pF

0.25 pF

0.35 pF

PAD 2

0.2 pF

0.4 pF

0.5 pF

0.75 pF

PAD 3

0.4 pF

0.8 pF

1.0 pF

1.5 pF

PAD 4

0.8 pF

1.6 pF

2.0 pF

3.0 pF

TOTAL

1.5 pF

3.0 pF

3.75 pF

5.6 pF

 

  

.020 x .020

913R7K-BOO

917R5K-BOO

9115ROK-BOO

9122R5K-BOO

PAD 1

0.25 pF

0.5 pF

1.0 pF

1.5 pF

PAD 2

0.5 pF

1.0 pF

2.0 pF

3.0 pF

PAD 3

1.0 pF

2.0 pF

4.0 pF

6.0 pF

PAD 4

2.0 pF

4.0 pF

8.0 pF

12.0 pF

TOTAL

3.75 pF

7.5 pF

15 pF

22.5 pF

 

 

.030 x .020

913R7K-BSP-1

917R5K-BSP-1

9115ROK-BSP-1

9122R5K-BSP-1

PAD 1

0.25 pF

0.5 pF

1.0 pF

1.5 pF

PAD 2

0.5 pF

1.0 pF

2.0 pF

3.0 pF

PAD 3

1.0 pF

2.0 pF

4.0 pF

6.0 pF

PAD 4

2.0 pF

4.0 pF

8.0 pF

12.0 pF

TOTAL

3.75 pF

7.5 pF

15 pF

22.5 pF

 

Insulation Resistance: 1012 Ohms Typical
Thermal Conductivity: 1.2°C/cm/W
Capacitance Range: 0.1 pF to 600 pF

 

 

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